XW
Wafer Printing Cell Bumping oder Wafer Backside Coating

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The flexible machining cell is designed for front or back side printing (bumping or wafer backside coating) on round wafers. The system consists of two main modules,
a loading unit and a printing system.

The loading unit in turn consists of three components: a magazine unloading
system, a robot unit and a pre-align station. The magazine unloading system is equipped with two magazine positions from where the wafers are fed to the machine. The 3-axis robot unit with vacuum end effector ensures a stress-free wafer transport.

Using a flexible pick-up, different end effectors can be used even for very
thin or curved wafers.

Features

  • Fully integrated cell concept, for wafers up to 8”, 12” optional
  • Prepared for two fluorware wafer magazines
  • 3-axis wafer robot with vacuum end effector
  • Integrated pre-align station unit (flat or notch detection)
  • Wafer printer XW with SIMPLEX user interface
  • More information see datasheet

 

Options

  • Preparation for different wafer sizes (up to 12“)
  • Preparation for double vacuum end effector
  • OCR recognition (2D recognition via the printer camera), optional wafer backlight,for best contrasts
  • More options see datasheet

 

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